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ASICs

XX YY

To Be Updated

Different YY identifiers are used based on the component type. For shipping purposes, ASICs are assembled to gelpacks.

Component XX YY
ABC SG AA
AMAC SG AH
HCC SG AM
Mixed Wafer (AMAC & HCC) SG WM
ABC Wafer SG WA
ABC Gelpack SG DA
AMA Gelpack SG DM
HCC Gelpack SG DH

NNNNNNN

All Component Types

For all ASIC related serial numbers, the first 4 digits of each serial number (NNNNNNN) is used to encode the wafer number

Wafers

For Wafters, the lest 3 digits are set to 0 (NNNN000).

Individual ASICs

For individual chips, the last 3 digits (NNNNNNN) are used to encode the position on the wafer for the chip (running number).

Gelpacks

For Gelpacks, the last 3 digits (NNNNFGH) are used to encode different information

  • F: used to encode the chip grade
    • 0 for category A
    • 1 for category B
    • 2 for category X
  • GH: used to count number of gelpacks from the particular wafer

ASIC Examples

Example for one HCC and related Wafer and Gelpack:
- Mixed Wafer: 20USGWM1044000
- HCC Chip: 20USGAH1044001
- HCC Gelpack: 20USGDH1044201