ASICs¶
XX YY¶
To Be Updated
Different YY identifiers are used based on the component type. For shipping purposes, ASICs are assembled to gelpacks.
Component | XX | YY |
---|---|---|
ABC | SG | AA |
AMAC | SG | AH |
HCC | SG | AM |
Mixed Wafer (AMAC & HCC) | SG | WM |
ABC Wafer | SG | WA |
ABC Gelpack | SG | DA |
AMA Gelpack | SG | DM |
HCC Gelpack | SG | DH |
NNNNNNN¶
All Component Types¶
For all ASIC related serial numbers, the first 4 digits of each serial number (NNNNNNN) is used to encode the wafer number
Wafers¶
For Wafters, the lest 3 digits are set to 0 (NNNN000).
Individual ASICs¶
For individual chips, the last 3 digits (NNNNNNN) are used to encode the position on the wafer for the chip (running number).
Gelpacks¶
For Gelpacks, the last 3 digits (NNNNFGH) are used to encode different information
- F: used to encode the chip grade
- 0 for category A
- 1 for category B
- 2 for category X
- 0 for category A
- GH: used to count number of gelpacks from the particular wafer
ASIC Examples¶
Example for one HCC and related Wafer and Gelpack:
- Mixed Wafer: 20USGWM1044000
- HCC Chip: 20USGAH1044001
- HCC Gelpack: 20USGDH1044201