TestType Structure for Module¶
Tables generated from PDB componentType data-strucutre
Tests Per Stage¶
stage code: MODULE/ASSEMBLY¶
| test_name | test_code | test_order |
|---|---|---|
| Mass Measurement | MASS_MEASUREMENT | 0 |
| Quad Module Metrology | QUAD_MODULE_METROLOGY | 1 |
| Glue Information Module+Flex Attach | GLUE_MODULE_FLEX_ATTACH | 2 |
| Triplet Module Metrology | TRIPLET_METROLOGY | 3 |
| Visual Inspection | VISUAL_INSPECTION | 4 |
| Flatness | FLATNESS | 5 |
stage code: MODULE/WIREBONDING¶
| test_name | test_code | test_order |
|---|---|---|
| Wirebonding Information | WIREBONDING | 0 |
| Wirebond pull test | WIREBOND_PULL_TEST | 1 |
| Visual Inspection | VISUAL_INSPECTION | 2 |
stage code: MODULE/INITIAL_WARM¶
| test_name | test_code | test_order |
|---|---|---|
| Electrical Test (e-test) Module Summary | E_SUMMARY | 0 |
| IV measurement | IV_MEASURE | 1 |
stage code: MODULE/INITIAL_COLD¶
| test_name | test_code | test_order |
|---|---|---|
| Electrical Test (e-test) Module Summary | E_SUMMARY | 0 |
| IV measurement | IV_MEASURE | 1 |
stage code: MODULE/PARYLENE_MASKING¶
| test_name | test_code | test_order |
|---|---|---|
| Visual Inspection | VISUAL_INSPECTION | 1 |
stage code: MODULE/PARYLENE_COATING¶
| test_name | test_code | test_order |
|---|---|---|
| Parylene Properties | PARYLENE | 0 |
| Visual Inspection | VISUAL_INSPECTION | 1 |
stage code: MODULE/PARYLENE_UNMASKING¶
| test_name | test_code | test_order |
|---|---|---|
| Mass Measurement | MASS_MEASUREMENT | 0 |
| Flatness | FLATNESS | 1 |
| Visual Inspection | VISUAL_INSPECTION | 2 |
| IV measurement | IV_MEASURE | 3 |
| Electrical Test (e-test) Module Summary | E_SUMMARY | 4 |
stage code: MODULE/POST_PARYLENE_WARM¶
| test_name | test_code | test_order |
|---|---|---|
| Electrical Test (e-test) Module Summary | E_SUMMARY | 0 |
| IV measurement | IV_MEASURE | 1 |
stage code: MODULE/POST_PARYLENE_COLD¶
| test_name | test_code | test_order |
|---|---|---|
| Electrical Test (e-test) Module Summary | E_SUMMARY | 0 |
| IV measurement | IV_MEASURE | 1 |
stage code: MODULE/WIREBOND_PROTECTION¶
| test_name | test_code | test_order |
|---|---|---|
| Electrical Test (e-test) Module Summary | E_SUMMARY | 0 |
| Wire bonding protection roof envelope | WP_ENVELOPE | 1 |
| Mass Measurement | MASS_MEASUREMENT | 2 |
| Visual Inspection | VISUAL_INSPECTION | 3 |
| IV measurement | IV_MEASURE | 4 |
stage code: MODULE/THERMAL_CYCLES¶
| test_name | test_code | test_order |
|---|---|---|
| Electrical Test (e-test) Module Summary | E_SUMMARY | 0 |
| Thermal Cycling | THERMAL_CYCLING | 1 |
| Flatness | FLATNESS | 2 |
| Visual Inspection | VISUAL_INSPECTION | 3 |
| IV measurement | IV_MEASURE | 4 |
stage code: MODULE/LONG_TERM_STABILITY_TEST¶
| test_name | test_code | test_order |
|---|---|---|
| Electrical Test (e-test) Module Summary | E_SUMMARY | 0 |
| IV measurement | IV_MEASURE | 1 |
stage code: MODULE/FINAL_WARM¶
| test_name | test_code | test_order |
|---|---|---|
| Electrical Test (e-test) Module Summary | E_SUMMARY | 0 |
| IV measurement | IV_MEASURE | 1 |
stage code: MODULE/FINAL_COLD¶
| test_name | test_code | test_order |
|---|---|---|
| Electrical Test (e-test) Module Summary | E_SUMMARY | 0 |
| IV measurement | IV_MEASURE | 1 |
stage code: MODULERECEPTION¶
| test_name | test_code | test_order |
|---|---|---|
| nan | nan | nan |
stage code: LOADINGCOMPLETE¶
| test_name | test_code | test_order |
|---|---|---|
| nan | nan | nan |
stage code: MODULE/UNHAPPY¶
| test_name | test_code | test_order |
|---|---|---|
| nan | nan | nan |
stage code: MODULE/COMPLETE¶
| test_name | test_code | test_order |
|---|---|---|
| nan | nan | nan |
Test Details¶
test code: MASS_MEASUREMENT¶
stages: MODULE/ASSEMBLY, MODULE/PARYLENE_UNMASKING, MODULE/WIREBOND_PROTECTION
properties
| name | code | description | dataType | valueType | required |
|---|---|---|---|---|---|
| Scale Accuracy [mg] | SCALE_ACCURACY | Scale accuracy [mg] | float | single | False |
| Analysis Version | ANALYSIS_VERSION | Analysis Version | string | single | False |
parameters
| name | code | description | dataType | valueType | required |
|---|---|---|---|---|---|
| Mass [mg] | MASS | Mass measurement in mg | float | single |
test code: QUAD_MODULE_METROLOGY¶
stages: MODULE/ASSEMBLY
properties
| name | code | description | dataType | valueType | required |
|---|---|---|---|---|---|
| Analysis Version | ANALYSIS_VERSION | Analysis Version | string | single | False |
parameters
| name | code | description | dataType | valueType | required |
|---|---|---|---|---|---|
| Sensor dimension in x [mm] | SENSOR_X | Sensor dimension in x [mm] | float | single | |
| Sensor dimension in y [mm] | SENSOR_Y | Sensor dimension in y [mm] | float | single | |
| Average sensor thickness (if total height out of specifications) [µm] | SENSOR_THICKNESS | Average sensor thickness (if total height out of specifications) [µm] | float | single | |
| Std deviation of sensor thickness (if total height out of specifications) [µm] | SENSOR_THICKNESS_STD_DEVIATION | Std deviation of sensor thickness (if total height out of specifications) [µm] | float | single | |
| FE chips x dimension [mm] | FECHIPS_X | FE chips x dimension [mm] | float | single | |
| FE chips y dimension [mm] | FECHIPS_Y | FE chips y dimension [mm] | float | single | |
| Average FE chip thickness [µm] | FECHIP_THICKNESS | Average FE chip thickness [µm] | float | single | |
| Std deviation of FE chip thickness [µm] | FECHIP_THICKNESS_STD_DEVIATION | Std deviation of FE chip thickness [µm] | float | single | |
| Average bare module thickness [µm] | BARE_MODULE_THICKNESS | Average bare module thickness [µm] | float | single | |
| Std deviation of bare module thickness [µm] | BARE_MODULE_THICKNESS_STD_DEVIATION | Std deviation of bare module thickness [µm] | float | single |
test code: GLUE_MODULE_FLEX_ATTACH¶
stages: MODULE/ASSEMBLY
properties
| name | code | description | dataType | valueType | required |
|---|---|---|---|---|---|
| Ratio of epoxy mixture | RATIO | float | single | False | |
| Glue Batch Number | BATCH_NUMBER | string | single | True | |
| Name | NAME | Name of person doing the operation | string | single | True |
| Glue type | GLUE_TYPE | string | single | True |
parameters
| name | code | description | dataType | valueType | required |
|---|---|---|---|---|---|
| Room Temperature | TEMP | float | single | True | |
| Humidity | HUMIDITY | float | single | True |
test code: TRIPLET_METROLOGY¶
stages: MODULE/ASSEMBLY
properties
| name | code | description | dataType | valueType | required |
|---|---|---|---|---|---|
| Version of cuts uses for pass/fail | CUTVERSION | Version of cuts uses for pass/fail | integer | single | False |
parameters
| name | code | description | dataType | valueType | required |
|---|---|---|---|---|---|
| Bare Module Displacement in The X Direction [mm] | DISPLACEMENT_X | Values are given in mm wrt to nominal. Each value is interpreted differently for Linear and Ring. | float | array | True |
| Average module thickness at chip pick-up areas, one per FE [μm] | MODULE_THICKNESS | Average module thickness at chip pick-up areas, one per FE [μm] | float | array | True |
| Std deviation of module thickness at chip pick-up area, one per FE [μm] | MODULE_THICKNESS_ERROR | Std deviation of module thickness at chip pick-up area, one per FE [μm] | float | array | True |
| Average glue thickness at chip pick-up areas per FE chip [μm] | THICKNESS_GLUE | Average glue thickness at chip pick-up areas, one per FE [μm] | float | array | True |
| Std deviation of glue thickness at chip pick-up area per FE chip [μm] | THICKNESS_GLUE_STD_DEV | Std deviation of glue thickness at chip pick-up area per FE chip [μm] | float | array | True |
| Thickness at the HV capacitor [μm] | THICKNESS_HV_CAP | Thickness at the HV capacitor [μm] | float | array | True |
| Average thickness at the data connector [μm] | THICKNESS_CONNECTOR | Average thickness at the data connector [μm] | float | single | True |
| PCB position w.r.t. module (top) [μm] | PCB_POSITION_TOP | PCB position w.r.t. module (top) [μm] | float | array | True |
| PCB position w.r.t. module (side) [μm] | PCB_POSITION_SIDE | PCB position w.r.t. module (side) [μm] | float | array | True |
| PCB position w.r.t. module (rotation) [μm] | PCB_POSITION_ROTATION | PCB position w.r.t. module (rotation) [μm] | float | array | True |
| Thickness of SMD Components [μm] | THICKNESS_SMD | Thickness of SMD Components [μm] | float | array | True |
| Bare Module Displacement in The Y Direction [mm] | DISPLACEMENT_Y | Values are given in mm wrt to nominal. Each value is interpreted differently for Linear and Ring. | float | array | True |
| Maximum length of module [mm] | MODULE_LENGTH | Maximum length of module [mm] | float | single | True |
test code: VISUAL_INSPECTION¶
stages: MODULE/ASSEMBLY, MODULE/WIREBONDING, MODULE/PARYLENE_MASKING, MODULE/PARYLENE_COATING, MODULE/PARYLENE_UNMASKING, MODULE/WIREBOND_PROTECTION, MODULE/THERMAL_CYCLES
properties
| name | code | description | dataType | valueType | required |
|---|---|---|---|---|---|
| Analysis Version | ANALYSIS_VERSION | Analysis Version | string | single | False |
parameters
| name | code | description | dataType | valueType | required |
|---|---|---|---|---|---|
| Damage Report (if applicable) | DAMAGE_REPORT | damage report (if applicable) | binary | single | |
| Defect source | DEFECTS | Defect source | codeTable | single | False |
| Front side image | FRONT_SIDE_IMAGE | Front side image | image | single | |
| Back side image | BACK_SIDE_IMAGE | Back side image | image | single | |
| SMD components passed QC (1: good, 2: issues, 3: bad) | SMD_COMPONENTS_PASSED_QC | SMD components passed QC (1: good, 2: issues, 3: bad) | integer | single | |
| Sensor condition passed QC (1: good, 2: issues, 3: bad) | SENSOR_CONDITION_PASSED_QC | Sensor condition passed QC (1: good, 2: issues, 3: bad) | integer | single | |
| FE chip condition passed QC (1: good, 2: issues, 3: bad) | FE_CHIP_CONDITION_PASSED_QC | FE chip condition passed QC (1: good, 2: issues, 3: bad) | integer | single | |
| Glue distribution passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad) | GLUE_DISTRIBUTION_PASSED_QC | Glue distribution passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad) | integer | single | |
| Wirebonding passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad) | WIREBONDING_PASSED_QC | Wirebonding passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad) | integer | single | |
| Parylene coating passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad) | PARYLENE_COATING_PASSED_QC | Parylene coating passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad) | integer | single |
test code: FLATNESS¶
stages: MODULE/ASSEMBLY, MODULE/PARYLENE_UNMASKING, MODULE/THERMAL_CYCLES
properties
| name | code | description | dataType | valueType | required |
|---|---|---|---|---|---|
| Analysis Version | ANALYSIS_VERSION | Analysis Version | string | single | True |
parameters
| name | code | description | dataType | valueType | required |
|---|---|---|---|---|---|
| Backside Flatness [µm] | BACKSIDE_FLATNESS | Backside Flatness [µm] | float | single | True |
| Angles from the reference plane for X and Y direction [deg] | ANGLES | Angles from the reference plane. Two angles of the fitted plane from the reference. One for each X and Y direction om degrees | float | array | True |
test code: WIREBONDING¶
stages: MODULE/WIREBONDING
properties
| name | code | description | dataType | valueType | required |
|---|---|---|---|---|---|
| Machine Used | MACHINE | string | single | False | |
| Operator Name | OPERATOR | string | single | False | |
| Bond wire batch | BOND_WIRE_BATCH | Bond wire batch number | string | single | False |
| Bond Program | BOND_PROGRAM | string | single | False | |
| Bonding Jig | BONDING_JIG | string | single | False |
parameters
| name | code | description | dataType | valueType | required |
|---|---|---|---|---|---|
| Humidity (%) | HUMIDITY | float | single | False | |
| Temperature (degC) | TEMPERATURE | float | single | False |
test code: WIREBOND_PULL_TEST¶
stages: MODULE/WIREBONDING
properties
| name | code | description | dataType | valueType | required |
|---|---|---|---|---|---|
| Operator | OPERATOR | #10.k The person performing the test | string | single | False |
| Instrument | INSTRUMENT | #10.l Make and Model of the instrument used to perform the test | string | single | False |
| Analysis Version | ANALYSIS_VERSION | #10.m Analysis Version | string | single | False |
parameters
| name | code | description | dataType | valueType | required |
|---|---|---|---|---|---|
| Number of wires pulled | WIRE_PULLS | #10.a Number of wires pulled | integer | single | False |
| Mean pull strength [g] | PULL_STRENGTH | #10.b Mean pull strength [g] | float | single | False |
| Std deviation of pull strength [g] | PULL_STRENGTH_ERROR | #10.c Std deviation of pull strength [g] | float | single | False |
| Number of wires breaking before 5g | WIRE_BREAKS_5G | #10.d: Number of wires breaking before 5g | integer | single | False |
| Minimum pull strength [g] | PULL_STRENGTH_MIN | #10.e Minimum pull strength [g] | float | single | False |
| Maximum pull strength [g] | PULL_STRENGTH_MAX | #10.f Maximum pull strength [g] | float | single | False |
| Percentage of heel breaks on FE chips [%] | HEEL_BREAKS_ON_FE_CHIP | #10.g Percentage of heel breaks on FE chips [%] | float | single | False |
| Percentage of heel breaks on PCB [%] | HEEL_BREAKS_ON_PCB | #10.h Percentage of heel breaks on PCB [%] | float | single | False |
| Percentage of bond peel on FE chip or PCB [%] | BOND_PEEL | #10.i Percentage of bond peel on FE chip or PCB [%] | float | single | False |
| Pull strength and grade data array | PULL_STRENGTH_GRADING | #10.j Pull strength and grade data array | float | array | False |
test code: E_SUMMARY¶
stages: MODULE/INITIAL_WARM, MODULE/INITIAL_COLD, MODULE/PARYLENE_UNMASKING, MODULE/POST_PARYLENE_WARM, MODULE/POST_PARYLENE_COLD, MODULE/WIREBOND_PROTECTION, MODULE/THERMAL_CYCLES, MODULE/LONG_TERM_STABILITY_TEST, MODULE/FINAL_WARM, MODULE/FINAL_COLD
properties
| name | code | description | dataType | valueType | required |
|---|---|---|---|---|---|
| Required temperature | MODULE_TEMPERATURE | Required temperature (°C) | float | True | |
| Analysis Version used to generate summary | ANALYSIS_VERSION | Analysis Version used to generate summary | string | True |
parameters
| name | code | description | dataType | valueType | required |
|---|---|---|---|---|---|
| ADC Calibration | MODULE_ADC_CALIBRATION | ADC Calibration | codeTable | single | True |
| Link to ADC Calibration of Chip 1 | MODULE_ADC_CALIBRATION_FE_LINK_1 | Link to ADC Calibration of Chip 1 | testRun | single | False |
| Link to ADC Calibration of Chip 2 | MODULE_ADC_CALIBRATION_FE_LINK_2 | Link to ADC Calibration of Chip 2 | testRun | single | False |
| Link to ADC Calibration of Chip 3 | MODULE_ADC_CALIBRATION_FE_LINK_3 | Link to ADC Calibration of Chip 3 | testRun | single | False |
| Link to ADC Calibration of Chip 4 | MODULE_ADC_CALIBRATION_FE_LINK_4 | Link to ADC Calibration of Chip 4 | testRun | single | False |
| SLDO | MODULE_SLDO | SLDO | codeTable | single | True |
| Link to SLDO of Chip 1 | MODULE_SLDO_FE_LINK_1 | Link to SLDO of Chip 1 | testRun | single | False |
| Link to SLDO of Chip 2 | MODULE_SLDO_FE_LINK_2 | Link to SLDO of Chip 2 | testRun | single | False |
| Link to SLDO of Chip 3 | MODULE_SLDO_FE_LINK_3 | Link to SLDO of Chip 3 | testRun | single | False |
| Link to SLDO of Chip 4 | MODULE_SLDO_FE_LINK_4 | Link to SLDO of Chip 4 | testRun | single | False |
| Vcal Calibration | MODULE_VCAL_CALIBRATION | Vcal Calibration | codeTable | single | True |
| Link to Vcal Calibration of Chip 1 | MODULE_VCAL_CALIBRATION_FE_LINK_1 | Link to Vcal Calibration of Chip 1 | testRun | single | False |
| Link to Vcal Calibration of Chip 2 | MODULE_VCAL_CALIBRATION_FE_LINK_2 | Link to Vcal Calibration of Chip 2 | testRun | single | False |
| Link to Vcal Calibration of Chip 3 | MODULE_VCAL_CALIBRATION_FE_LINK_3 | Link to Vcal Calibration of Chip 3 | testRun | single | False |
| Link to Vcal Calibration of Chip 4 | MODULE_VCAL_CALIBRATION_FE_LINK_4 | Link to Vcal Calibration of Chip 4 | testRun | single | False |
| Analog Readback | MODULE_ANALOG_READBACK | Analog Readback | codeTable | single | True |
| Link to Analog Readback of Chip 1 | MODULE_ANALOG_READBACK_FE_LINK_1 | Link to Analog Readback of Chip 1 | testRun | single | False |
| Link to Analog Readback of Chip 2 | MODULE_ANALOG_READBACK_FE_LINK_2 | Link to Analog Readback of Chip 2 | testRun | single | False |
| Link to Analog Readback of Chip 3 | MODULE_ANALOG_READBACK_FE_LINK_3 | Link to Analog Readback of Chip 3 | testRun | single | False |
| Link to Analog Readback of Chip 4 | MODULE_ANALOG_READBACK_FE_LINK_4 | Link to Analog Readback of Chip 4 | testRun | single | False |
| Low Power Mode | MODULE_LP_MODE | Low Power Mode | codeTable | single | True |
| Link to Low Power Mode of Chip 1 | MODULE_LP_MODE_FE_LINK_1 | Link to Low Power Mode of Chip 1 | testRun | single | False |
| Link to Low Power Mode of Chip 2 | MODULE_LP_MODE_FE_LINK_2 | Link to Low Power Mode of Chip 2 | testRun | single | False |
| Link to Low Power Mode of Chip 3 | MODULE_LP_MODE_FE_LINK_3 | Link to Low Power Mode of Chip 3 | testRun | single | False |
| Link to Low Power Mode of Chip 4 | MODULE_LP_MODE_FE_LINK_4 | Link to Low Power Mode of Chip 4 | testRun | single | False |
| Overvoltage Protection | MODULE_OVERVOLTAGE_PROTECTION | Overvoltage Protection | codeTable | single | True |
| Link to Overvoltage Protection of Chip 1 | MODULE_OVERVOLTAGE_PROTECTION_FE_LINK_1 | Link to Overvoltage Protection of Chip 1 | testRun | single | False |
| Link to Overvoltage Protection of Chip 2 | MODULE_OVERVOLTAGE_PROTECTION_FE_LINK_2 | Link to Overvoltage Protection of Chip 2 | testRun | single | False |
| Link to Overvoltage Protection of Chip 3 | MODULE_OVERVOLTAGE_PROTECTION_FE_LINK_3 | Link to Overvoltage Protection of Chip 3 | testRun | single | False |
| Link to Overvoltage Protection of Chip 4 | MODULE_OVERVOLTAGE_PROTECTION_FE_LINK_4 | Link to Overvoltage Protection of Chip 4 | testRun | single | False |
| Injection Capacitance | MODULE_INJECTION_CAPACITANCE | Injection Capacitance | codeTable | single | True |
| Link to Injection Capacitance of Chip 1 | MODULE_INJECTION_CAPACITANCE_FE_LINK_1 | Link to Injection Capacitance of Chip 1 | testRun | single | False |
| Link to Injection Capacitance of Chip 2 | MODULE_INJECTION_CAPACITANCE_FE_LINK_2 | Link to Injection Capacitance of Chip 2 | testRun | single | False |
| Link to Injection Capacitance of Chip 3 | MODULE_INJECTION_CAPACITANCE_FE_LINK_3 | Link to Injection Capacitance of Chip 3 | testRun | single | False |
| Link to Injection Capacitance of Chip 4 | MODULE_INJECTION_CAPACITANCE_FE_LINK_4 | Link to Injection Capacitance of Chip 4 | testRun | single | False |
| Min Health Test | MODULE_MIN_HEALTH_TEST | Min Health Test | codeTable | single | True |
| Link to Min Health Test of Chip 1 | MODULE_MIN_HEALTH_TEST_FE_LINK_1 | Link to Min Health Test of Chip 1 | testRun | single | False |
| Link to Min Health Test of Chip 2 | MODULE_MIN_HEALTH_TEST_FE_LINK_2 | Link to Min Health Test of Chip 2 | testRun | single | False |
| Link to Min Health Test of Chip 3 | MODULE_MIN_HEALTH_TEST_FE_LINK_3 | Link to Min Health Test of Chip 3 | testRun | single | False |
| Link to Min Health Test of Chip 4 | MODULE_MIN_HEALTH_TEST_FE_LINK_4 | Link to Min Health Test of Chip 4 | testRun | single | False |
| Tuning | MODULE_TUNING | Tuning | codeTable | single | True |
| Link to Tuning of Chip 1 | MODULE_TUNING_FE_LINK_1 | Link to Tuning of Chip 1 | testRun | single | False |
| Link to Tuning of Chip 2 | MODULE_TUNING_FE_LINK_2 | Link to Tuning of Chip 2 | testRun | single | False |
| Link to Tuning of Chip 3 | MODULE_TUNING_FE_LINK_3 | Link to Tuning of Chip 3 | testRun | single | False |
| Link to Tuning of Chip 4 | MODULE_TUNING_FE_LINK_4 | Link to Tuning of Chip 4 | testRun | single | False |
| Pixel Failure Analysis | MODULE_PIXEL_FAILURE_ANALYSIS | Pixel Failure Analysis | codeTable | single | True |
| Link to Pixel Failure Analysis of Chip 1 | MODULE_PIXEL_FAILURE_ANALYSIS_FE_LINK_1 | Link to Pixel Failure Analysis of Chip 1 | testRun | single | False |
| Link to Pixel Failure Analysis of Chip 2 | MODULE_PIXEL_FAILURE_ANALYSIS_FE_LINK_2 | Link to Pixel Failure Analysis of Chip 2 | testRun | single | False |
| Link to Pixel Failure Analysis of Chip 3 | MODULE_PIXEL_FAILURE_ANALYSIS_FE_LINK_3 | Link to Pixel Failure Analysis of Chip 3 | testRun | single | False |
| Link to Pixel Failure Analysis of Chip 4 | MODULE_PIXEL_FAILURE_ANALYSIS_FE_LINK_4 | Link to Pixel Failure Analysis of Chip 4 | testRun | single | False |
| Number of bad pixels | MODULE_BAD_PIXEL_NUMBER | Number of bad pixels | integer | single | False |
| Number of electrically bad pixels | MODULE_ELECTRICALLY_BAD_PIXEL_NUMBER | Number of electrically bad pixels | integer | single | False |
| Number of disconnected pixels | MODULE_DISCONNECTED_PIXEL_NUMBER | Number of disconnected pixels | integer | single | False |
| Number of bad pixels for Chip 1 | MODULE_BAD_PIXEL_NUMBER_FE_1 | Number of bad pixels for Chip 1 | integer | single | False |
| Number of bad pixels for Chip 2 | MODULE_BAD_PIXEL_NUMBER_FE_2 | Number of bad pixels for Chip 2 | integer | single | False |
| Number of bad pixels for Chip 3 | MODULE_BAD_PIXEL_NUMBER_FE_3 | Number of bad pixels for Chip 3 | integer | single | False |
| Number of bad pixels for Chip 4 | MODULE_BAD_PIXEL_NUMBER_FE_4 | Number of bad pixels for Chip 4 | integer | single | False |
| Highest number of bad pixels in a cluster | MODULE_HIGHEST_NUMBER_BAD_PIXELS_CLUSTER | Highest number of bad pixels in a cluster | integer | single | False |
| Highest number of bad pixels in a cluster for Chip 1 | MODULE_HIGHEST_NUMBER_BAD_PIXELS_CLUSTER_FE_1 | Highest number of bad pixels in a cluster for Chip 1 | integer | single | False |
| Highest number of bad pixels in a cluster for Chip 2 | MODULE_HIGHEST_NUMBER_BAD_PIXELS_CLUSTER_FE_2 | Highest number of bad pixels in a cluster for Chip 2 | integer | single | False |
| Highest number of bad pixels in a cluster for Chip 3 | MODULE_HIGHEST_NUMBER_BAD_PIXELS_CLUSTER_FE_3 | Highest number of bad pixels in a cluster for Chip 3 | integer | single | False |
| Highest number of bad pixels in a cluster for Chip 4 | MODULE_HIGHEST_NUMBER_BAD_PIXELS_CLUSTER_FE_4 | Highest number of bad pixels in a cluster for Chip 4 | integer | single | False |
| Number of electrically bad pixels for Chip 1 | MODULE_ELECTRICALLY_BAD_PIXEL_NUMBER_FE_1 | Number of electrically bad pixels for Chip 1 | integer | single | False |
| Number of electrically bad pixels for Chip 2 | MODULE_ELECTRICALLY_BAD_PIXEL_NUMBER_FE_2 | Number of electrically bad pixels for Chip 2 | integer | single | False |
| Number of electrically bad pixels for Chip 3 | MODULE_ELECTRICALLY_BAD_PIXEL_NUMBER_FE_3 | Number of electrically bad pixels for Chip 3 | integer | single | False |
| Number of electrically bad pixels for Chip 4 | MODULE_ELECTRICALLY_BAD_PIXEL_NUMBER_FE_4 | Number of electrically bad pixels for Chip 4 | integer | single | False |
| Number of disconnected pixels for Chip 1 | MODULE_DISCONNECTED_PIXEL_NUMBER_FE_1 | Number of disconnected pixels for Chip 1 | integer | single | False |
| Number of disconnected pixels for Chip 2 | MODULE_DISCONNECTED_PIXEL_NUMBER_FE_2 | Number of disconnected pixels for Chip 2 | integer | single | False |
| Number of disconnected pixels for Chip 3 | MODULE_DISCONNECTED_PIXEL_NUMBER_FE_3 | Number of disconnected pixels for Chip 3 | integer | single | False |
| Number of disconnected pixels for Chip 4 | MODULE_DISCONNECTED_PIXEL_NUMBER_FE_4 | Number of disconnected pixels for Chip 4 | integer | single | False |
| Undershunt protection | MODULE_UNDERSHUNT_PROTECTION | Undershunt protection | codeTable | single | True |
| Link to undershunt protection test of chip 1 | MODULE_UNDERSHUNT_PROTECTION_FE_LINK_1 | Link to undershunt protection test of chip 1 | testRun | single | False |
| Link to undershunt protection test of chip 2 | MODULE_UNDERSHUNT_PROTECTION_FE_LINK_2 | Link to undershunt protection test of chip 2 | testRun | single | False |
| Link to undershunt protection test of chip 3 | MODULE_UNDERSHUNT_PROTECTION_FE_LINK_3 | Link to undershunt protection test of chip 3 | testRun | single | False |
| Link to undershunt protection test of chip 4 | MODULE_UNDERSHUNT_PROTECTION_FE_LINK_4 | Link to undershunt protection test of chip 4 | testRun | single | False |
| Data transmission | MODULE_DATA_TRANSMISSION | Data transmission | codeTable | single | True |
| Link to data transmission test of chip 1 | MODULE_DATA_TRANSMISSION_FE_LINK_1 | Link to data transmission test of chip 1 | testRun | single | False |
| Link to data transmission test of chip 2 | MODULE_DATA_TRANSMISSION_FE_LINK_2 | Link to data transmission test of chip 2 | testRun | single | False |
| Link to data transmission test of chip 3 | MODULE_DATA_TRANSMISSION_FE_LINK_3 | Link to data transmission test of chip 3 | testRun | single | False |
| Link to data transmission test of chip 4 | MODULE_DATA_TRANSMISSION_FE_LINK_4 | Link to data transmission test of chip 4 | testRun | single | False |
test code: IV_MEASURE¶
stages: MODULE/INITIAL_WARM, MODULE/INITIAL_COLD, MODULE/PARYLENE_UNMASKING, MODULE/POST_PARYLENE_WARM, MODULE/POST_PARYLENE_COLD, MODULE/WIREBOND_PROTECTION, MODULE/THERMAL_CYCLES, MODULE/LONG_TERM_STABILITY_TEST, MODULE/FINAL_WARM, MODULE/FINAL_COLD
properties
| name | code | description | dataType | valueType | required |
|---|---|---|---|---|---|
| Temperature (°C) | TEMP | Measured temperature | float | single | True |
| Humidity (%) | HUM | Measured relative humidity | float | single | True |
| Analysis Version | ANALYSIS_VERSION | Analysis Version | string | single | False |
parameters
| name | code | description | dataType | valueType | required |
|---|---|---|---|---|---|
| IV data | IV_ARRAY | IV data array | object | single | True |
| Plot of IV curves | IV_IMG | IV characteristics | image | single | |
| Breakdown voltage (V) | BREAKDOWN_VOLTAGE | Measured breakdown voltage | float | single | True |
| Leakage current of sensor (μA) | LEAK_CURRENT | Measured leakage current of (Planar/3D sensor at depletion voltage + 50V/20V) | float | single | True |
test code: PARYLENE¶
stages: MODULE/PARYLENE_COATING
properties
| name | code | description | dataType | valueType | required |
|---|---|---|---|---|---|
| Parylene Batch Number | BATCH_NUMBER | string | single | False | |
| Parylene Type | PARYLENE_TYPE | string | single | False | |
| Name of Masking Operator | MASKING_OPERATOR | string | single | True | |
| Name of Operator Removing Mask | REMOVING_MASK_OPERATOR | string | single | True |
parameters
| name | code | description | dataType | valueType | required |
|---|---|---|---|---|---|
| Parylene thickness measured by vendor | THICKNESS | float | single | True | |
| Parylene thickness measured by ITk Institute | THICKNESS_ITK | float | single | True |
test code: WP_ENVELOPE¶
stages: MODULE/WIREBOND_PROTECTION
properties
| name | code | description | dataType | valueType | required |
|---|---|---|---|---|---|
| Analysis Version | ANALYSIS_VERSION | #11.e Analysis version | string | single | False |
parameters
| name | code | description | dataType | valueType | required |
|---|---|---|---|---|---|
| Distance btw Roof and PCB edges in X | DISTANCE_X | #11.a Four values for each FE position. Given in [mm]. | float | array | False |
| Distance btw Roof and PCB edges in Y | DISTANCE_Y | #11.b Four values for each FE position. Given in [mm]. | float | array | False |
| Mean total thickness on the pickup circles (i.e. FE+bump+Sensor+adhesive+PCB+adhesive+Roof) | THICKNESS_MEAN | #11.c Four values for each FE position. Given in [mm]. | float | array | False |
| Std. dev. of total thickness on the pickup circles | THICKNESS_STDDEV | #11.d Four values for each FE position. Given in [mm]. | float | array | False |
test code: THERMAL_CYCLING¶
stages: MODULE/THERMAL_CYCLES
properties
| name | code | description | dataType | valueType | required |
|---|---|---|---|---|---|
| Machine | MACHINE | Machine name | string | single | False |
| Minimum Temperature | MIN_TEMP | (C) | float | single | False |
| Maximum Temperature | MAX_TEMP | float | single | False | |
| Number of Cycles | NUM_CYCLES | integer | single | False | |
| Thermal Cycling Speed | CYCLING_SPEED | K/min | float | single | False |
parameters
NB required flag missing