ComponentType Structure for Sensor Tile
Notice
Page generated: 2023-06-01
See source code here
For updates/fixes contact: wraightATcern.ch
Tables generated from PDB componentType data-strucutre
Types
name |
code |
existing |
L1 Inner Pixel Quad Sensor Tile |
L1_INNER_PIXEL_QUAD_SENSOR_TILE |
True |
Outer Pixel Quad Sensor Tile |
OUTER_PIXEL_QUAD_SENSOR_TILE |
True |
Half-size Planar Sensor Tile (100 µm thickness) |
HALF-SIZE_PLANAR_SENSOR_TILE_100 |
True |
Half-size Planar Sensor Tile (150 µm thickness) |
HALF-SIZE_PLANAR_SENSOR_TILE_150 |
True |
Full-size Planar Sensor Tile (100 µm thickness) |
FULL-SIZE_PLANAR_SENSOR_TILE_100 |
True |
Full-size Planar Sensor Tile (150 µm thickness) |
FULL-SIZE_PLANAR_SENSOR_TILE_150 |
True |
Planar Sensor Test Structure (100 µm thickness) |
PLANAR_SENSOR_TEST_STRUCTURE_100 |
True |
Planar Sensor Test Structure (150 µm thickness) |
PLANAR_SENSOR_TEST_STRUCTURE_150 |
True |
Half-size 3D Sensor Tile (25x100) |
HALF-SIZE_3D_SENSOR_TILE_25 |
True |
Half-size 3D Sensor Tile (50x50) |
HALF-SIZE_3D_SENSOR_TILE_50 |
True |
Full-size 3D Sensor Tile (25x100) |
FULL-SIZE_3D_SENSOR_TILE_25 |
True |
Full-size 3D Sensor Tile (50x50) |
FULL-SIZE_3D_SENSOR_TILE_50 |
True |
L0 Inner Pixel 3D Sensor Tile (25x100) |
L0_INNER_PIXEL_3D_SENSOR_TILE_25 |
False |
L0 Inner Pixel 3D Sensor Tile (50x50) |
L0_INNER_PIXEL_3D_SENSOR_TILE_50 |
True |
3D Sensor Test Structure (25x100) |
3D_SENSOR_TEST_STRUCTURE_25 |
True |
3D Sensor Test Structure (50x50) |
3D_SENSOR_TEST_STRUCTURE_50 |
True |
Tutorial Sensor Tile |
TUTORIAL_SENSOR_TILE |
True |
Dummy teststructure |
DUMMY_TESTSTRUCTURE |
True |
Planar Sensor Halfmoon (100 µm thickness) |
PLANAR_SENSOR_HALFMOON_100 |
True |
Planar Sensor Halfmoon (150 µm thickness) |
PLANAR_SENSOR_HALFMOON_150 |
True |
3D Sensor Halfmoon (50x50) |
3D_SENSOR_HALFMOON_50 |
True |
3D Sensor Halfmoon (25x100) |
3D_SENSOR_HALFMOON_25 |
True |
Properties
name |
code |
description |
required |
Main Vendor |
MAIN_VENDOR |
Enter the number corresponding to the sensor wafer vendor |
True |
Sensor Type or Test Structure |
SENSOR_TYPE_OR_TEST_STRUCTURE |
Enter the number of the corresponding sensor type (0-3) or test structure (4-9) |
True |
Version of component |
VERSION |
Is the component for prototype, pre-production or production |
True |
Scratch id (to be used if not the same as agreed manufacturer ID) |
SENSOR_SCRATCHID |
Scratch id (to be used if not the same as agreed manufacturer ID) |
False |
Alternative Identifier |
MAN_SNO |
|
True |
Original Manufacturer ID |
MAN_ID |
|
False |
Flags
name |
code |
With Temporary Metal |
TEMP_METAL |
Sensor rejected by vendor |
BAD_ON_WAFER |
Sensor rejected after dicing |
BAD_AFTER_DICING |
Sensor with issues at vendor level |
YELLOW_ON_WAFER |
Sensor with issues after dicing |
YELLOW_AFTER_DICING |
Sensor with UBM |
UBM |
No biasing structure |
NO_BIASING_STRUCTURE |
Returned to vendor |
RETURNED_TO_VENDOR |
Stages
Table
name |
code |
order |
alternative |
initial |
final |
Sensor Manufacturer |
sensor_manufacturer |
1 |
False |
True |
False |
Wafer Processing (dicing, UBM, flip-chip) |
WAFER_PROCESSING |
2 |
False |
False |
False |
QA at Institutes |
QA |
3 |
True |
False |
False |
Post Irradiation |
POST_IRRAD |
4 |
True |
False |
False |
Not to be used for detector |
NOT_USED |
5 |
True |
False |
False |
Bare Module Assembly |
BAREMODULEASSEMBLY |
7 |
False |
False |
False |
Bare module reception at ITk institute |
BAREMODULERECEPTION |
8 |
False |
False |
False |
Bare module to module PCB assembly |
MODULE/ASSEMBLY |
9 |
False |
False |
False |
Wire Bonding |
MODULE/WIREBONDING |
10 |
False |
False |
False |
Initial Warm |
MODULE/INITIAL_WARM |
11 |
False |
False |
False |
Initial Cold |
MODULE/INITIAL_COLD |
12 |
False |
False |
False |
Parylene Masking |
MODULE/PARYLENE_MASKING |
13 |
False |
False |
False |
Parylene Coating |
MODULE/PARYLENE_COATING |
14 |
False |
False |
False |
Parylene Unmasking |
MODULE/PARYLENE_UNMASKING |
15 |
False |
False |
False |
Post-Parylene Warm |
MODULE/POST_PARYLENE_WARM |
16 |
False |
False |
False |
Post-Parylene Cold |
MODULE/POST_PARYLENE_COLD |
17 |
False |
False |
False |
Wirebond Protection (alt) |
MODULE/WIREBOND_PROTECTION |
18 |
True |
False |
False |
Thermal Cycles |
MODULE/THERMAL_CYCLES |
19 |
False |
False |
False |
Long Term Stability Test |
MODULE/LONG_TERM_STABILITY_TEST |
20 |
False |
False |
False |
Final Warm |
MODULE/FINAL_WARM |
21 |
False |
False |
False |
Final Cold |
MODULE/FINAL_COLD |
22 |
False |
False |
False |
Modules failed test, needs investigation |
MODULE/UNHAPPY |
23 |
False |
False |
False |
Module Complete |
MODULE/COMPLETE |
24 |
False |
False |
True |
Mermaid Diagram
flowchart LR
subgraph Production Stages
subgraph "Sensor Manufacturer"
a1["code: sensor_manufacturer"]
a2["tests:
CV measurement
IV measurement
"]
end
subgraph "Wafer Processing (dicing, UBM, flip-chip)"
b1["code: WAFER_PROCESSING"]
b2["tests:
Visual inspection
Sensor Metrology: Sensor bow and thickness
IV measurement
CV measurement
"]
end
subgraph "QA at Institutes (alternative)"
c1["code: QA"]
c2["tests:
CV measurement
IV measurement
IT measurement
Inter-pixel capacitance
Inter-pixel resistance
Sensor Metrology: Sensor bow and thickness
"]
end
subgraph "Post Irradiation (alternative)"
d1["code: POST_IRRAD"]
d2["tests:
IV measurement
CV measurement
"]
end
subgraph "Not to be used for detector (alternative)"
e1["code: NOT_USED"]
e2["tests:
"]
end
subgraph "Bare Module Assembly"
f1["code: BAREMODULEASSEMBLY"]
f2["tests:
"]
end
subgraph "Bare module reception at ITk institute"
g1["code: BAREMODULERECEPTION"]
g2["tests:
IV measurement
"]
end
subgraph "Bare module to module PCB assembly"
h1["code: MODULE/ASSEMBLY"]
h2["tests:
"]
end
subgraph "Wire Bonding"
i1["code: MODULE/WIREBONDING"]
i2["tests:
"]
end
subgraph "Initial Warm"
j1["code: MODULE/INITIAL_WARM"]
j2["tests:
"]
end
subgraph "Initial Cold"
k1["code: MODULE/INITIAL_COLD"]
k2["tests:
"]
end
subgraph "Parylene Masking"
l1["code: MODULE/PARYLENE_MASKING"]
l2["tests:
"]
end
subgraph "Parylene Coating"
m1["code: MODULE/PARYLENE_COATING"]
m2["tests:
"]
end
subgraph "Parylene Unmasking"
n1["code: MODULE/PARYLENE_UNMASKING"]
n2["tests:
"]
end
subgraph "Post-Parylene Warm"
o1["code: MODULE/POST_PARYLENE_WARM"]
o2["tests:
"]
end
subgraph "Post-Parylene Cold"
p1["code: MODULE/POST_PARYLENE_COLD"]
p2["tests:
"]
end
subgraph "Wirebond Protection (alt) (alternative)"
q1["code: MODULE/WIREBOND_PROTECTION"]
q2["tests:
"]
end
subgraph "Thermal Cycles"
r1["code: MODULE/THERMAL_CYCLES"]
r2["tests:
"]
end
subgraph "Long Term Stability Test"
s1["code: MODULE/LONG_TERM_STABILITY_TEST"]
s2["tests:
"]
end
subgraph "Final Warm"
t1["code: MODULE/FINAL_WARM"]
t2["tests:
"]
end
subgraph "Final Cold"
u1["code: MODULE/FINAL_COLD"]
u2["tests:
"]
end
subgraph "Modules failed test, needs investigation"
v1["code: MODULE/UNHAPPY"]
v2["tests:
"]
end
end
subgraph Final Stages
subgraph "Module Complete"
w1["code: MODULE/COMPLETE"]
w2["tests:
"]
end
end
Relatives
Parents
type: *
name |
code |
Sensor Wafer |
SENSOR_WAFER |
Bare Module |
BARE_MODULE |
Bare Module |
BARE_MODULE |
Bare Module |
BARE_MODULE |
Bare Module |
BARE_MODULE |
Bare Module |
BARE_MODULE |
type: L1_INNER_PIXEL_QUAD_SENSOR_TILE
name |
code |
Sensor Wafer |
SENSOR_WAFER |
type: PLANAR_SENSOR_TEST_STRUCTURE_100
name |
code |
Sensor Wafer |
SENSOR_WAFER |
type: OUTER_PIXEL_QUAD_SENSOR_TILE
name |
code |
Sensor Wafer |
SENSOR_WAFER |
type: HALF-SIZE_PLANAR_SENSOR_TILE_100
name |
code |
Sensor Wafer |
SENSOR_WAFER |
type: FULL-SIZE_PLANAR_SENSOR_TILE_100
name |
code |
Sensor Wafer |
SENSOR_WAFER |
type: HALF-SIZE_PLANAR_SENSOR_TILE_150
name |
code |
Sensor Wafer |
SENSOR_WAFER |
type: FULL-SIZE_PLANAR_SENSOR_TILE_150
name |
code |
Sensor Wafer |
SENSOR_WAFER |
type: HALF-SIZE_3D_SENSOR_TILE_25
name |
code |
Sensor Wafer |
SENSOR_WAFER |
type: HALF-SIZE_3D_SENSOR_TILE_50
name |
code |
Sensor Wafer |
SENSOR_WAFER |
type: FULL-SIZE_3D_SENSOR_TILE_25
name |
code |
Sensor Wafer |
SENSOR_WAFER |
type: FULL-SIZE_3D_SENSOR_TILE_50
name |
code |
Sensor Wafer |
SENSOR_WAFER |
type: 3D_SENSOR_TEST_STRUCTURE_25
name |
code |
Sensor Wafer |
SENSOR_WAFER |
type: 3D_SENSOR_TEST_STRUCTURE_50
name |
code |
Sensor Wafer |
SENSOR_WAFER |
type: L0_INNER_PIXEL_3D_SENSOR_TILE_25
name |
code |
Sensor Wafer |
SENSOR_WAFER |
type: L0_INNER_PIXEL_3D_SENSOR_TILE_50
name |
code |
Sensor Wafer |
SENSOR_WAFER |
type: TUTORIAL_SENSOR_TILE
name |
code |
Bare Module |
BARE_MODULE |
Children
type: PLANAR_SENSOR_HALFMOON_100
name |
code |
Sensor Tile |
SENSOR_TILE |
type: PLANAR_SENSOR_HALFMOON_150
name |
code |
Sensor Tile |
SENSOR_TILE |
type: 3D_SENSOR_HALFMOON_50
name |
code |
Sensor Tile |
SENSOR_TILE |
type: 3D_SENSOR_HALFMOON_25
name |
code |
Sensor Tile |
SENSOR_TILE |