TestType Structure for Module PCB

Notice

Page generated: 2023-06-01

See source code here

For updates/fixes contact: wraightATcern.ch

Tables generated from PDB componentType data-strucutre

Tests Per Stage

stage code: PCB_RECEPTION

test_name	test_code	test_order
Visual Inspection	VISUAL_INSPECTION	6
Metrology	METROLOGY	2
Dowel Tolerance Check	DOWEL_TOLERANCE_CHECK	3
Layer thickness measurement	LAYER_THICKNESS	4

stage code: PCB_POPULATION

test_name	test_code	test_order
Visual Inspection	VISUAL_INSPECTION	2
Component Position Check	COMPONENT_POSITION_CHECK	2

stage code: PCB_CUTTING

test_name	test_code	test_order
Quick visual inspection	QUICK_INSPECTION	1

stage code: QA_PRE_THERMAL_CYCLE

test_name	test_code	test_order
SLDO and precision resistors	SLDO_RESISTORS	2
NTC Verification	NTC_VERIFICATION	3
Signal Transmission	SIGNAL_TRANSMISSION	4
Via resistance	VIA_RESISTANCE	5
Wirebond pull test	WIREBOND_PULL_TEST	6
Layer thickness measurement	LAYER_THICKNESS	6

stage code: QA_POST_THERMAL_CYCLE

test_name	test_code	test_order
NTC Verification	NTC_VERIFICATION	1
Via resistance	VIA_RESISTANCE	2
Wirebond pull test	WIREBOND_PULL_TEST	3

stage code: PCB_QC

test_name	test_code	test_order
LV and HV Test	HV_LV_TEST	2
Dowel Tolerance Check	DOWEL_TOLERANCE_CHECK	2

stage code: UNHAPPY

test_name	test_code	test_order
nan	nan	nan

stage code: PCB_RECEPTION_MODULE_SITE

test_name	test_code	test_order
Visual Inspection	VISUAL_INSPECTION	1
Mass	MASS	2
Metrology	METROLOGY	3

stage code: COMPLETE

test_name	test_code	test_order
nan	nan	nan

stage code: MODULE/ASSEMBLY

test_name	test_code	test_order
nan	nan	nan

stage code: MODULE/WIREBONDING

test_name	test_code	test_order
nan	nan	nan

stage code: MODULE/INITIAL_WARM

test_name	test_code	test_order
nan	nan	nan

stage code: MODULE/INITIAL_COLD

test_name	test_code	test_order
nan	nan	nan

stage code: MODULE/PARYLENE_MASKING

test_name	test_code	test_order
nan	nan	nan

stage code: MODULE/PARYLENE_COATING

test_name	test_code	test_order
nan	nan	nan

stage code: MODULE/PARYLENE_UNMASKING

test_name	test_code	test_order
nan	nan	nan

stage code: MODULE/POST_PARYLENE_WARM

test_name	test_code	test_order
nan	nan	nan

stage code: MODULE/POST_PARYLENE_COLD

test_name	test_code	test_order
nan	nan	nan

stage code: MODULE/WIREBOND_PROTECTION

test_name	test_code	test_order
nan	nan	nan

stage code: MODULE/THERMAL_CYCLES

test_name	test_code	test_order
nan	nan	nan

stage code: MODULE/LONG_TERM_STABILITY_TEST

test_name	test_code	test_order
nan	nan	nan

stage code: MODULE/FINAL_WARM

test_name	test_code	test_order
nan	nan	nan

stage code: MODULE/FINAL_COLD

test_name	test_code	test_order
nan	nan	nan

stage code: MODULE/UNHAPPY

test_name	test_code	test_order
nan	nan	nan

stage code: MODULE/COMPLETE

test_name	test_code	test_order
nan	nan	nan

Test Details

test code: VISUAL_INSPECTION

stages: PCB_RECEPTION, PCB_POPULATION, PCB_RECEPTION_MODULE_SITE

properties

name	code	description	dataType	valueType	required
Operator	OPERATOR	The person performing the test	string	single	False
Instrument	INSTRUMENT	Make and Model of the instrument used to perform the test	string	single	False
Analysis version	ANALYSIS_VERSION	Analysis version	string	single	False

parameters

NB required flag missing

name	code	description	dataType	valueType
Optical high resolution front image	OPTICAL_IMAGE_FRONT	Optical high resolution front image	image	single
Optical high resolution back image	OPTICAL_IMAGE_BACK	Optical high resolution back image	image	single
Wirebond pads clear of contamination grade (scale 1-3)	WIREBOND_PADS_CONTAMINATION_GRADE	Wirebond pads clear of contamination grade (scale 1-3)	integer	single
Particulate contamination grade (scale 1-3)	PARTICULATE_CONTAMINATION_GRADE	Particulate contamination grade (scale 1-3)	integer	single
Watermarks grade (scale 1-3)	WATERMARKS_GRADE	Watermarks grade (scale 1-3)	integer	single
Scratches grade (scale 1-3)	SCRATCHES_GRADE	Scratches grade (scale 1-3)	integer	single
Soldermask irregularity/cracks grade (scale 1-3)	SOLDERMASK_IRREGULARITIES_GRADE	Soldermask irregularity/cracks grade (scale 1-3)	integer	single
HV LV connector assembly issue grade (scale 1-3)	HV_LV_CONNECTOR_ASSEMBLY_GRADE	HV LV connector assembly issue grade (scale 1-3)	integer	single
Data connector assembly issue grade (scale 1-3)	DATA_CONNECTOR_ASSEMBLY_GRADE	Data connector assembly issue grade (scale 1-3)	integer	single
Solder spills grade (scale 1-3)	SOLDER_SPILLS_GRADE	Solder spills grade (scale 1-3)	integer	single
Component misalignment grade (scale 1-3)	COMPONENT_MISALIGNMENT_GRADE	Component misalignment grade (scale 1-3)	integer	single
Shorts/close proximity of components due to misalignment grade (scale 1-3)	SHORTS_OR_CLOSE_PROXIMITY_GRADE	Shorts/close proximity of components due to misalignment grade (scale 1-3)	integer	single
Overall grade (scale 1-5)	OVERALL_GRADE	Overall grade (scale 1-5 with 1 no damages, 5 severe damages)	integer	single
Observation	OBSERVATION	Observation	string	single

test code: METROLOGY

stages: PCB_RECEPTION, PCB_RECEPTION_MODULE_SITE

properties

name	code	description	dataType	valueType	required
Operator	OPERATOR	The person performing the test	string	single	False
Instrument	INSTRUMENT	Make and Model of the instrument used to perform the test	string	single	False
Analysis Version	ANALYSIS_VERSION	Analysis Version	string	single	False

parameters

NB required flag missing

name	code	description	dataType	valueType
X dimension [mm]	X_DIMENSION	PCB X dimension [mm]	float	single
Y dimension [mm]	Y_DIMENSION	PCB Y dimension [mm]	float	single
X-Y dimension within envelope [mm]	X-Y_DIMENSION_WITHIN_ENVELOP	X-Y dimension within envelope [mm]	boolean	single
Average thickness of all FE chip pick-up areas [mm]	AVERAGE_THICKNESS_FECHIP_PICKUP_AREAS	Average thickness of all FE chip pick-up areas [mm]	float	single
Std deviation of thickness of all FE chip pick-up area [mm]	STD_DEVIATION_THICKNESS_FECHIP_PICKUP_AREAS	Std deviation of thickness of all FE chip pick-up area [mm]	float	single
HV capacitor thickness [mm]	HV_CAPACITOR_THICKNESS	HV capacitor thickness [mm]	float	single
HV capacitor thickness within envelop	HV_CAPACITOR_THICKNESS_WITHIN_ENVELOP	HV capacitor thickness within envelop	boolean	single
Thickness including the black body of power connector (excluding pins) [mm]	AVERAGE_THICKNESS_POWER_CONNECTOR	Thickness including the black body of power connector (excluding pins) [mm]	float	single
Diameter of dowel hole A (top left) (for PCB reception from vendor only) [mm]	DIAMETER_DOWEL_HOLE_A	Diameter of dowel hole A (top left) (for PCB reception from vendor only) [mm]	float	single
Width of dowel slot B (bottom right) (for PCB reception from vendor only) [mm]	WIDTH_DOWEL_SLOT_B	Width of dowel slot B (bottom right) (for PCB reception from vendor only) [mm]	float	single

test code: DOWEL_TOLERANCE_CHECK

stages: PCB_RECEPTION, PCB_QC

properties

name	code	description	dataType	valueType	required
Operator	OPERATOR	Operator	string	single	False
Instrument	INSTRUMENT	Instrument	string	single	False
Analysis version	ANALYSIS_VERSION	Analysis version	string	single	False

parameters

name	code	description	dataType	valueType	required
Observations	OBSERVATIONS	Observations	string	single	False

test code: LAYER_THICKNESS

stages: PCB_RECEPTION, QA_PRE_THERMAL_CYCLE

properties

name	code	description	dataType	valueType	required
Operator	OPERATOR	Operator	string	single	False
Instrument	INSTRUMENT	Instrument	string	single	False
Analysis Version	ANALYSIS_VERSION	Analysis Version	string	single	False

parameters

NB required flag missing

name	code	description	dataType	valueType
Top layer thickness (including ENIG) [µm]	TOP_LAYER_THICKNESS	Top layer thickness (including ENIG) [µm]	float	single
Inner layer thickness [µm]	INNER_LAYER_THICKNESS	Inner layer thickness [µm]	float	single
Bottom layer thickness (including ENIG) [µm]	BOTTOM_LAYER_THICKNESS	Bottom layer thickness (including ENIG) [µm]	float	single
Dielectric thickness [µm]	DIELECTRIC_THICKNESS	Dielectric thickness [µm]	float	single
Coverlay with Adhesive thickness [µm]	COVERLAY_WITH_ADHESIVE_THICKNESS	Coverlay with Adhesive thickness [µm]	float	single
Soldermask thickness [µm]	SOLDERMASK_THICKNESS	Soldermask thickness [µm]	float	single
Total PCB thickness [µm]	THICKNESS	Total PCB thickness [µm]	float	single

test code: COMPONENT_POSITION_CHECK

stages: PCB_POPULATION

properties

name	code	description	dataType	valueType	required
Operator	OPERATOR	Operator	string	single	False
Instrument	INSTRUMENT	Instrument	string	single	False
Analysis version	ANALYSIS_VERSION	Analysis version	string	single	False

parameters

name	code	description	dataType	valueType	required
Observation	OBSERVATION	Observation	string	single	False

test code: QUICK_INSPECTION

stages: PCB_CUTTING

properties

name	code	description	dataType	valueType	required
Operator	OPERATOR	Operator	string	single	False
Instrument	INSTRUMENT	Instrument	string	single	False
Analysis version	ANALYSIS_VERSION	Analysis version	string	single	False

parameters

name	code	description	dataType	valueType	required
Observation	OBSERVATION	Observation	string	single	False

test code: SLDO_RESISTORS

stages: QA_PRE_THERMAL_CYCLE

properties

name	code	description	dataType	valueType	required
Operator	OPERATOR	name of person performing the test	string	single	True
Instrument	INSTRUMENT	Make and Model of the instrument used for the test	string	single	True
Analysis Version	ANALYSIS_VERSION	Analysis Version	string	single	False

parameters

name	code	description	dataType	valueType	required
SLDO resistor value (Analog) - R47 [Ω]	R47_ANALOG	SLDO resistor value (Analog) - R47 [Ω]	float	single	True
SLDO resistor value (Digital) - R51 [Ω]	R51_DIGITAL	SLDO resistor value (Digital) - R51 [Ω]	float	single	True
R44 resistor [kΩ]	R44	R44 resistor [kΩ]	float	single	True
R45 resistor [kΩ]	R45	R45 resistor [kΩ]	float	single	True
R46 resistor [kΩ]	R46	R46 resistor [kΩ]	float	single	True
R48 resistor [kΩ]	R48	R48 resistor [kΩ]	float	single	True
R49 resistor [kΩ]	R49	R49 resistor [kΩ]	float	single	True
R7 resistor [kΩ]	R7	R7 resistor [kΩ]	float	single	True
R52 resistor [kΩ]	R52	R52 resistor [kΩ]	float	single	True
TH5 NTC [kΩ]	TH5_NTC	TH5 NTC [kΩ]	float	single	True

test code: NTC_VERIFICATION

stages: QA_PRE_THERMAL_CYCLE, QA_POST_THERMAL_CYCLE

properties

name	code	description	dataType	valueType	required
Operator	OPERATOR	Name of the operator performing the test	string	single	True
Instrument	INSTRUMENT	make and Model of the instrument used for the test	string	single	True
Analysis Version	ANALYSIS_VERSION	Analysis Version	string	single	False

parameters

NB required flag missing

name	code	description	dataType	valueType
NTC value [kΩ]	NTC_VALUE	NTC value [kΩ]	float	single
NTC Temperature [°C]	NTC_TEMP	NTC Temperature [°C], derived from either voltage or Resistance measurement	float	array
Humidity [RH%]	HUMIDITY	Humidity [RH%]	float	single

test code: SIGNAL_TRANSMISSION

stages: QA_PRE_THERMAL_CYCLE

properties

name	code	description	dataType	valueType	required
Operator	OPERATOR	The person performing the test	string	single	True
Instrument	INSTRUMENT	Make and Model of the instrument used to perform the test	string	single	True
Analysis Version	ANALYSIS_VERSION	Analysis Version	string	single	False

parameters

NB required flag missing

name	code	description	dataType	valueType
S-parameter S21(downlink) [dB]	DOWNLINK_S21	S21 dB at XXX MHz for Downlink	float	single
S-parameter S22 (downlink) [dB]	DOWNLINK_S22	S-parameter S22 (downlink) [dB]	float	single
S-parameter S21 (uplink) [dB]	UPLINK_S21	S-parameter S21 (uplink) [dB]	float	single
S-parameter S22 (uplink) [dB]	UPLINK_S22	S-parameter S22 (uplink) [dB]	float	single
S-parameter plot	S_PLOT	S-parameter plot	image	single
S-parameter file	S_PARAMETER_FILE	4-port S-parameter file, *.s4p format	binary	single
Impedance Value (downlink) [Ω]	DOWNLINK_IMPEDANCE	Impedance Value (downlink) [Ω]	float	single
Impedance Value (uplink) [Ω]	UPLINK_IMPEDANCE	Impedance Value (uplink) [Ω]	float	single
Impedance plot	IMPEDANCE_PLOT	Impedance plot	image	single

test code: VIA_RESISTANCE

stages: QA_PRE_THERMAL_CYCLE, QA_POST_THERMAL_CYCLE

properties

name	code	description	dataType	valueType	required
Operator	OPERATOR	The person performing the test	string	single	True
Instrument	INSTRUMENT	Make and Model of the instrument used to perform the test	string	single	True
Analysis Version	ANALYSIS_VERSION	Analysis Version	string	single	False

parameters

name	code	description	dataType	valueType	required
Resistance [Ω]	RESISTANCE	Resistance of via [Ω]	float	single	True
Temperature [°C]	TEMPERATURE	Ambient Temperature at time of test [°C]	float	single	True
Relative Humidity [RH%]	HUMIDITY	Relative Humidity at time of test [RH%]	float	single	True

test code: WIREBOND_PULL_TEST

stages: QA_PRE_THERMAL_CYCLE, QA_POST_THERMAL_CYCLE

properties

name	code	description	dataType	valueType	required
Operator	OPERATOR	The person performing the test	string	single	False
Instrument	INSTRUMENT	Make and Model of the instrument used to perform the test	string	single	False
Analysis Version	ANALYSIS_VERSION	Analysis Version	string	single	False

parameters

name	code	description	dataType	valueType	required
Mean strength	MEAN_STRENGTH	Mean pull strength	float	single	True
Standard deviation strength	STDDEV_STRENGTH	Standard deviation of pull strength	float	single	True
Test Array	TEST_ARRAY	Individual pull test array: force and failure description	string	array	True
Pull summary	PULL_SUMMARY	Attachment with each pull and its value and break description	object	single	True
Number of wires pulled	WIRE_PULLS	Number of wires pulled	integer	single	True
Mean pull strength [g]	PULL_STRENGTH	Mean pull strength [g]	float	single	True
Std deviation of pull strength [g]	PULL_STRENGTH_ERROR	Std deviation of pull strength [g]	float	single	True
Number of wires breaking before 5g	WIRE_BREAKS_5G	Number of wires breaking before 5g	float	single	True
Minimum pull strength [g]	PULL_STRENGTH_MIN	Minimum pull strength [g]	float	single	True
Maximum pull strength [g]	PULL_STRENGTH_MAX	Maximum pull strength [g]	float	single	True
Percentage of heel breaks on FE chips [%]	HEEL_BREAKS_ON_FE_CHIP	Percentage of heel breaks on FE chips [%]	float	single	True
Percentage of heel breaks on PCB [%]	HEEL_BREAKS_ON_PCB	Percentage of heel breaks on PCB [%]	float	single	True
Percentage of bond peel on FE chip or PCB [%]	BOND_PEEL	Percentage of bond peel on FE chip or PCB [%]	float	single	True
Pull strength and grade data array	PULL_STRENGTH_GRADING	Pull strength and grade data array	float	array	True

test code: HV_LV_TEST

stages: PCB_QC

properties

name	code	description	dataType	valueType	required
Operator	OPERATOR	Operator	string	single	False
Instrument	INSTRUMENT	Instrument	string	single	False
Analysis version	ANALYSIS_VERSION	Analysis version	string	single	False

parameters

NB required flag missing

name	code	description	dataType	valueType
Vin Drop [V]	VIN_DROP	Vin Drop [V]	float	single
GND Drop [V]	GND_DROP	GND Drop [V]	float	single
Effective resistance of the PCB [mΩ]	EFFECTIVE_RESISTANCE	Effective resistance of the PCB [mΩ]	float	single
HV leakage value [V]	HV_LEAKAGE	HV leakage value [V]	float	single
Leakage current [nA]	LEAKAGE_CURRENT	Leakage current [nA]	float	single
NTC voltage [V]	NTC_VOLTAGE	NTC voltage [V]	float	single
NTC value [kΩ]	NTC_VALUE	NTC value [kΩ]	float	single
Temperature [°C]	TEMPERATURE	Temperature [°C]	float	single
Relative Humidity [RH%]	HUMIDITY	Relative Humidity [RH%]	float	single
Damage comment	DAMAGE_COMMENT	Damage comment	string	single
Damage image	DAMAGE_IMAGE	Damage image	image	single
R1 - HV resistor value [kΩ]	R1_HV_RESISTOR	R1 - HV resistor value [kΩ]	float	single

test code: MASS

stages: PCB_RECEPTION_MODULE_SITE

properties

name	code	description	dataType	valueType	required
Operator	OPERATOR	Name of the person performing the test	string	single	False
Instrument Make & Model	INSTRUMENT	Make and Model of the instrument used to perform the test	string	single	False
Analysis Version	ANALYSIS_VERSION	Analysis Version	string	single	False

parameters

name	code	description	dataType	valueType	required
Mass [mg]	MASS	Measured Mass [mg]	float	single	True