Disassembly of the Sensor Tiles

Sensor tiles should be disassembled from the sensor wafer in the ITk production databse when the wafer being diced in the real world. The format file of the list of the wafers could be downloaded by pressing on the example file button.

The dicing state could be chosen from the downloaded file and comments on the wafer state could be added.

A table of the uploading file data and the extracted collection of these data would be shown. The process of converting the alternative identifier and checking on each sensor wafer in the ITk production database would be automatically.

If the sensor wafers are found in the ITk production database, a table of the wafers information would be display coloured rely on the type code of the component. The wafers of sensor tiles which are not disassemled will be tabulated and by click on the Disassembly button, a list of dicing wafers and the message of the disassembly confirmation will appear.